Sinmat continues to strive towards our goal of several planarization technologies for next generation semiconductor manufacturing and clean electronic applications. Funded by several competitive federal and corporate grants, Sinmat is developing several products, some of which are outlined below. Most notably, Sinmat has been awarded the R&D 100 award in 2004, 2005, 2008, and 2009 for developing one of the top 100 most significant technologies in each of those years.

Sinmat develops products via planarization-enabled technologies used in semiconductor manufacturing for computer chips, solid state lighting, and power devices. The products include slurries and processes for manufacturing of substrates and circuits, new engineered substrates for clean technology applications, and high value-added planarization-enabled devices..

Slurries and Processes for Silicon Semiconductor Manufacturing


Sinmat has developed specialized slurries for CMP of copper interconnects, shallow trench isolation (STI), and dielectric materials. The copper CMP technology relies on unique oxidizers to achieve ultra-smooth, low defectivity polishing. The STI and dielectric polishing is based on unique particles that achieve high planarity and low defectivity. Sinmat has developed novel CMP technologies for next-generation semiconductor materials such as ruthenium and related hard metals and alloys.

Planarization-Enabled, Engineered Substrates and Devices


Sinmat applies its unique expertise in CMP to develop engineered substrates and device technologies. These include low defectivity GaN/SiC film growth technologies, innovative light extraction polishing methods, and light in-coupling methods for solid state lighting and solar cells.

CMP-Enabled Devices

Sinmat has developed new planarization technologies for creating low defectivity epitaxial films of compound semiconductors, fabricating engineered substrates for enhanced light extraction for LEDs and OLEDs, and light in-coupling for solar cells. Other planarization-enabled technologies currently under development include compound semiconductor-based devices (GaN, diamond).