Sinmat has developed unique CMP slurries using nanodiamond particles. By synergistically combining the mechanical and chemical effects, the removal rates can be significantly enhanced with achieving almost a CMP like mirror surface. These slurries are especially useful in polishing ultra-hard materials such as diamond, SiC, GaN and sapphire. Removal rates between 10 to 40 microns/hr can be achieved while the surface finish is below 1 nm. Such processes are also very useful for polishing mirrors for optical applications. Specifics on polishing of materials such as SiC, GaN, sapphire and diamond can be found in each product listing.
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