Sinmat has developed unique CMP processes to achieve higher polish rates and excellent surfaces for sapphire wafers of different orientations namely C-plane, A-plane, R-plane, etc. These products are unique as they provide an extremely high performance/cost ratio which is enabled by Sinmat’s patented additives in the slurry.
Sapphire Slurry Products
C- Place CMP Slurries (SL7000, SL4000 Series)These CMP slurries have the ability to achieve extremely high polish rates on C-plane sapphire wafers. Based on the pad integration, slurries can be tailored for optimum performance
A-Plane CMP Slurries (SL 1200 Series)These CMP slurries have the capability to achieve extremely high polish rates on A-plane sapphire wafers.
Pre-CMP Nanodiamond Slurries (SAP-ND Series)Nano size diamond particles are used to achieve very high removal rates (20 to 40 microns/hr) which create very low sub-surface damage